| 摘要 |
<p>PURPOSE:To contrive to reduce the adhesion of foreign substances on semiconductor wafers by a method wherein grooves are formed in the upper and lower interior surfaces of the main body, of a semiconductor wafer jig for housing wafers; only of the main body is opened; and the wafers are housed through this opened one side. CONSTITUTION:This jig is a semiconductor wafer jig 1, which is used at the time of handlings of the change of transfer, the change of loading and transfer of semiconductor wafers, and the jig 1 is constituted into a structure wherein a main body 2 is formed into the form of a square cylinder, an open window 3 is formed in one side surface of the main body 2, grooves 4 of a constant pitch are formed in the upper and lower interior surfaces of the main body 2 and the semiconductor wafers 5 are housed side by side. Moreover, the wafers 5 are taken out and in through the window 3, that is, from the direction of the one side surface of the main body. Thereby, the adhesion of foreign substances at the time of handlings of the change of transfer, the change of loading, transfer and the like of the wafers 5 is reduced and the adhesion of falling foreign substances is reduced by the fact that the window 3 is formed in the side surface of the main body.</p> |
