| 摘要 |
An IC package for an integrated circuit chip (3) includes a cavity (2) in which the IC chip (3) is mounted, a wall (12) surrounding the IC chip, and a groove (4) formed in the surrounding wall (12) extending to surround and communicate with the cavity (2). For fabricating the IC package, a resin of an amount more than necessary is filled in the cavity (2), and is pressed by a press plate. The excess of the resin overflowing from the cavity (2) is received in the groove (4). As a result, the exposed surface of the filled resin is formed into a predetermined shape without grinding thereof. |
