| 摘要 |
PURPOSE:To suppress occurrence of chip crack due to the package stress by specifying the direction of a scribe line. CONSTITUTION:When an oriental flat 5 is made perpendicular to the crystal direction (010) of a substrate, the scribe line 4 of a gallium arsenic chip 2 having an electrode element points the directions of (010), (001). Through these procedures, the line 4 can make an angle of 45 deg. with the cleavage direction of GaAs thereby enabling the development ratio of chip crack due to the package stress to be decreased. |
