| 摘要 |
<p>PURPOSE:To reduce the time and the cost necessary for mounting by forming, on a board surface, recessed parts becoming gradually deep from the periphery toward the center part and accepting at least the tip parts of bumps on a semiconductor element. CONSTITUTION:A plurality of bumps 2 are formed on a semiconductor element 1 so as to protrude from the surface. On a board 3 on which the element 1 is mounted, a plurality of electrode terminals 5 are formed so as to correspond with the bumps 2. An electrode terminal 5 is formed at the center part of the recessed part 4, which is formed so as to have a size capable of accepting at least the tip part of the bump 2. The recessed part 4 is formed so as to become deep gradually from the outer periphery toward the center part where the terminal 5 is formed. The recessed part 4 is formed so as to become deep gradually by a step-wise or smooth surface. Hence the bumps 2 can be accurately aligned with the terminals 5 only by pushing the element 1 on the board 3 after rough alignment, so that the time and the cost necessary for mounting can be reduced.</p> |
