RESIN SEALING METHOD FOR SEMICONDUCTOR DEVICE,申请号JP19900014159-传众专利搜索

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发明名称	RESIN SEALING METHOD FOR SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH03218032(A)	申请公布日期	1991.09.25
申请号	JP19900014159	申请日期	1990.01.23
申请人	MATSUSHITA ELECTRON CORP	发明人	SAKAGUCHI SHIGEKI
分类号	H01L21/56;H01L23/50	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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