| 摘要 |
<p>In the multilayer printed board of the present invention, the space for disposing the outer-layer terminal land 11 at a through-hole 8 and the connecting portion between the outer-layer terminal land 11 and the soldering pad 14 for a component 13 to be mounted can completely be eliminated by the sharing of the outer-layer terminal land 11 of the through- hole 8 with the soldering pad 14 of a component 13 to be mounted, thereby to facilitate high-density wiring and packaging. <IMAGE></p> |
