发明名称 SURFACE TREATMENT OF INTERNAL-LAYER BASE MATERIAL FOR MULTILAYER COPPER-CLAD LAMINATED BOARD
摘要 PURPOSE:To enable a surface treatment film to be formed uniformly on an internal-layer base surface for stabilizing and improving contact with the internal-layer base material of a multilayer substrate and for enhancing the reliability by allowing a surface treatment liquid to contact the internal-layer base material and then by squeezing the surface treatment liquid of the internal-layer base material by a squeezing roller where the surface roughness is adjusted within a specific range. CONSTITUTION:In a method for performing surface treatment onto an oxidized film surface of a copper foil 2 of an internal-layer base material 1 for forming a multilayer copper-clad laminated board, a surface treatment liquid 3 is allowed to contact the internal-layer base material 1, the surface treatment liquid 3 of the internal-layer base material 1 is squeezed by a squeezing roller 6 where the surface roughness is adjusted to 5-159mum, and then the surface treatment liquid 3 is uniformly adhered onto the internal-layer base material 1 for performing surface treatment and forming a surface treatment film. For example, after the internal-layer base material 1 is dipped into the surface treatment liquid 3 within a treatment liquid bath 4 while the internal-layer base material 1 which is to be treated is suspended by a suspension tool 5, it is allowed to pass through the squeezing roller 6 which is provided on it, surface treatment liquid which is adhered onto the surface of the internal-layer base material 1 is squeezed, and then it is uniformly adhered onto the entire surface of the internal- layer base material 1.
申请公布号 JPH03217075(A) 申请公布日期 1991.09.24
申请号 JP19900012045 申请日期 1990.01.22
申请人 MITSUBISHI ELECTRIC CORP 发明人 KIMURA MINORU;FUTAKUCHI MICHIO;KAIZUMI YUTAKA;NAGATA SHOICHI
分类号 H05K3/46 主分类号 H05K3/46
代理机构 代理人
主权项
地址