| 摘要 |
PURPOSE:To effectively bond the lead of an IC component with high productivity by mounting the component on a mounting head, then laser-heating the lead in a state that the component is pressed fixedly, and bonding it. CONSTITUTION:An IC component 2 is separately cut while it is sucked to a suction nozzle 15, and positioned at a position directly above an IC component mounting position. A bonding metal 10 is formed previously on an electrode to be bonded with the lead 11 of the component 2 on a board 3. The nozzle 15 is moved down as by an arrow, the component 2 is mounted on the board 3, and pressed fixedly. Then, a laser light is emitted to the lead 11 of the component 2 via the opening 19 of the nozzle 15 to heat to melt a bonding metal layer 10 to bond the lead 11 to the electrode. The light is scanned along two parallel sides of the component 2 as by an arrow C with a solid line at the time of bonding, a rotary frame 91 then turned at 90 deg. as by an arrow D, the light is scanned as by an arrow E with a broken line, and the leads 11 of the remaining two sides are also bonded. |
