APPARATUS FOR ELECTRICALLY TESTING PRINTED CIRCUIT BOARDS HAVING CONTACT PADS IN AN EXTREMELY FINE GRIP

摘要

A circuit board testing apparatus includes a plurality of contact elements located in a contact array plane. The contact elements are connected to an electronic control and test structure and during testing are connected through longitudinally rigid test pins to contact portions of a connection carrier or circuit board to be tested. The contact elements are mounted to yield resiliently and are supported against the contact pressure applied during testing. The contact elements are in the form of electrically conductive compression springs located and guided directly in bores in a spring contact array body formed of an electrically insulating material. The rigid test pins seat directly on the compression springs.