| 摘要 |
<p>PURPOSE:To obtain the title sheet capable of attracting and holding a semiconductor wafer with a solder bump formed on the surface to the attraction surface of a vacuum chuck so that the sheet has the strength enough to withstand a processing force at the time of processing the rear surface, by causing the sheet to have a structure, where many pores are formed in the manner of passing through two layers of base film and adhesive. CONSTITUTION:A pressure-sensitive adhesive sheet 3 to be stuck on the attraction plate 6 side surface of a semiconductor wafer 1 to be attracted and held to the attraction surface of an attraction plate 6 while evacuating air on the rear surface side of the plate 6, where the front and rear surfaces forming the flat attraction surface communicate with each other via pores, is composed of two layers of a base film 3B and an adhesive 3A applied to one surface of the base film 3B and many pores 3C are formed in a manner of passing through the two layers. For example, the title sheet consists of two layers of the adhesive 3A composed of ultraviolet-curing acrylic resin and the base film 3B composed of polyolefin resin, to one surface of which the adhesive 3A is applied, and many pores of 0.2-0.5mm pore size are formed in a manner of passing through three layers of release film 4, adhesive 3A and base film 3B.</p> |
