| 摘要 |
PURPOSE:To allow the heating treatment of solder in a gaseous nitrogen atmosphere by disposing a substrate transporting conveyor in the position lower than a feeding conveyor and an ejecting conveyor, constituting these two conveyors freely liftably and transferring and receiving substrates to and from the substrate transporting conveyor in the down position. CONSTITUTION:The substrate 7 transported to the feeding conveyor 13 is transferred to the substrate transporting conveyor 6 by the descending of this conveyor 13. While the substrate 7 is transported by this conveyor 6, the substrate is subjected to the heating treatment in the gaseous nitrogen atmosphere sinking in the lower part of a body box 1. This substrate is then transferred to the ejecting conveyor 14. This conveyor 14 rises and the substrate 7 is ejected to the outside of the body box 1. The solder applied on the substrate 7 is subjected to the heating treatment in the gaseous nitrogen atmosphere in this way while the unnecessary outflow of the gaseous nitrogen is prevented. |
