发明名称 RESIN MOLDED ITEM
摘要 PURPOSE:To obtain the above resin molded item, which has high surface hardness and being suitable for mass-production and free in molding size by a method wherein thermosetting resin layer is integrally provided on the surface of amino compound-containing specified thermoplastic resin molded item. CONSTITUTION:Thermosetting resin layer is integrally provided on the surface of thermoplastic resin molded item, which contains amino compound and have the melting point of 170 deg.C or higher. Here, as the amino compound, single or denatured amino compound of urea, melamine, guanamine or the like or their mixture is exemplified and preferably 2 - 100pts.wt. of it is added to 100pts. wt. of the thermoplastic resin having the melting point of 170 deg.C or higher. Further, as the thermosetting resin layer, single or denatured thermosetting resin such as urea resin, melamine resin or the like or their mixture is exemplified and the thermosetting resin layer is integrated under heat and pressure with the thermoplastic molded item, which is produced by applying and hardening resin varnish. Thus, the surface hardness has been enhanced and the scratch resistance improved, maintaining the mass-production suitability of the resin molded item.
申请公布号 JPH03215029(A) 申请公布日期 1991.09.20
申请号 JP19900011457 申请日期 1990.01.19
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 ISHIDA TOSHIO
分类号 B32B27/08;B29C43/20;B29K61/20;C08L101/00;C08L101/02 主分类号 B32B27/08
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