发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PURPOSE:To obtain the positive type photoresist compsn. having a high resolving power by incorporating a specific compd. and alkaline-soluble novolak resin into the photosensitive resin compsn. CONSTITUTION:The positive type photoresist compsn. which can form resist patterns of the sectional shape having a high aspect ratio in patterns of <=1mum line width is obtd. by using the photosensitive resin compsn. contg. the compd. expressed by general formula (A) and the alkaline-soluble novolak resin. The alkaline-soluble novolak resin is obtd. by subjecting 0.6 to 1.0mol aldehydes per 1mol phenols to addition condensation in the presence of an acidic catalyst. The using ratio of the photosensitive material and the alkaline-soluble novolak resin is 5 to 100pts.wt. photosensitive material per 100pts.wt. novolak resin. The residual film rate is extremely inferior if this using ratio is below 5pts.wt. and the degradation in the sensitivity and the solubility in solvents is resulted when the rate exceeds 100pts.wt.
申请公布号 JPH03215862(A) 申请公布日期 1991.09.20
申请号 JP19900010424 申请日期 1990.01.19
申请人 FUJI PHOTO FILM CO LTD 发明人 TAN SHIRO;SAKAGUCHI SHINJI
分类号 G03F7/022;H01L21/027;H01L21/30 主分类号 G03F7/022
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