发明名称 |
HEAT-MINIATURIZABLE PRINTED CIRCUIT BOARD |
摘要 |
The present invention relates to the manufacture of printed circuit boards and, particularly, to a process of miniaturizing said printed circuit board. |
申请公布号 |
HK73891(A) |
申请公布日期 |
1991.09.20 |
申请号 |
HK19910000738 |
申请日期 |
1991.09.12 |
申请人 |
W.R. GRACE & CO.-CONN. |
发明人 |
ECKART MATHIAS;WILLIAM ALFRED FEEHLEY |
分类号 |
H05K3/12;H05K1/03;H05K1/09;H05K3/00;H05K3/22;(IPC1-7):H05K1/03;H05K3/10 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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