| 摘要 |
<p>PURPOSE:To prevent the crack of a glass protective film of a semiconductor wafer by bonding a transparent tape on the surface of a wafer, forming a reference line in X-Y axes direction outside of the wafer and dividing the wafer from the back surface. CONSTITUTION:A transparent or translucent tape 4 is bonded on a wafer 1 formed with a glass protective film 2 on the surface. The tape 4 is position as the ordinary method and is scribed in X-axis and Y-axis directions by a scriber 5, and a mark line 6 is drawn on the portion except the outer diameter of the wafer. The wafer 1 is the inverted, the mark 6 is matched to the reference, and the tape is scribed. A rubber roller is pressed from the opposite side of the scribing surface, and the wafer is thus divided into pellets. According to this structure, the wafer can be readily divided from the back surface with the glass protective film without using a special device.</p> |
