| 摘要 |
<p>PURPOSE:To make it possible to prevent a printed substrate from scorching by a method wherein a resistance layer and the like are formed on the heat- resisting insulated substrate of 0.7mm or more in thickness. CONSTITUTION:The title chip resistor is composed of a heat-resisting insulating layer of 0.7mm or more in thickness, a thick silver film upper electrode layer 2 to be formed on the insulated substrate, a thick ruthenium film resistor layer 4 which will be overlapped on a part of the upper electrode layer, an overcoat glass layer 5 with which the resistor layer 4 will be covered completely, and a thick silver film edge-face electrode layer 3 which is overlapped on a part of the upper surface electrode layer. Accordingly, even when the resistor is mounted on a printed substrate snd high power is applied, heat-rediating effect is enhanced due to the increase in thickness of the substrate 1 of a square- shaped chip resistor, and as a result, the heat generated on the surface of the chip resistor is hardly transferred directly below. Consequently, the scorching of the printed substrate can be prevented.</p> |
