| 摘要 |
PURPOSE:To improve environment resistance and noise resistance without enlarging mounting structure by covering a chip-shaped integrated circuit with an insulating resin layer and also covering a ground conductor pattern inclusive of the insulating resin layer with a conductive resin layer for shielding. CONSTITUTION:A chip-shaped integrated circuit 13, which is mounted in a state of being bonded with a wire in the specified area on a flexible printed board 21 fitted with electromagnetic shield, is covered with an insulating resin layer 15. This is put in a mounting structure that a conductive resin layer 26 for shielding is overlaid thereon in a state of being connected with a ground conductor 24 pattern, and that the shield conductor 26 in the flexible printed board 21 fitted with electromagnetic shield corresponding to the chip-shaped integrated circuit 13 is also connected to the ground conductor 24 pattern, etc. Hereby, the environment resistance of the integrated circuit improves without enlarging the mounting structure, and also since it is shielded and sandwiched between the conductive resin layer for shielding and the shield conductor of the flexible printed board fitted with electromagnetic shield, the noise resistance to extraneous electromagnetic wave noise, etc., improves. |
