发明名称 HOUSING AND TRANSFER APPARATUS OF SEMICONDUCTOR WAFER
摘要 <p>PURPOSE:To easily transfer and store a wafer between semiconductor treatment apparatus without being exposed to the air and to eliminate that the surface of the wafer is contaminated with dust particles produced inside a vacuum apparatus by a method wherein a jig used to, at the inside of a load-lock chamber, open and shut a lid which airtightly closes a semiconductor-wafer taking-out and carrying-into port is installed at the load-lock chamber. CONSTITUTION:A semiconductor-wafer housing and transfer container 10 is structured in such a way that it can be attached to and detached from a load- lock chamber 2; a jig 8 is installed in such a way that a lid 11 of a semiconductor-wafer taking-out and carrying-into port of the semiconductor- wafer housing and transfer container 10 can be opened and shut at the inside of the load-lock chamber 2. Consequently, a wafer can be transferred between treatment apparatus in a vacuum or in an inert-gas atmosphere. Thereby, it is possible to eliminate that the surface of the wafer is contaminated with dust particles produced inside a vacuum treatment apparatus and that the wafer is contaminated when it is transferred or stored in the air.</p>
申请公布号 JPH03214645(A) 申请公布日期 1991.09.19
申请号 JP19900010836 申请日期 1990.01.18
申请人 MITSUBISHI ELECTRIC CORP 发明人 OMORI TOSHIAKI;HAMA MASAHARU;FUJINO TAKESHI
分类号 H01L21/673;H01L21/68 主分类号 H01L21/673
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