INTEGRATED CIRCUIT WITH EMBEDDED DIGITAL SIGNAL PROCESSOR

摘要

PURPOSE: To eliminate problems in terms of signal transmission mutually between chips by forming a digital signal processor circuit at a part of the surface of a semiconductor substrate and an additional circuit at the remaining part of the surface. CONSTITUTION: The chip 10 is provided with the semiconductor substrate and a digital signal processor 12 is formed on a part of the surface area of the chip 10. The remaining usable area of the chip 10 can be used as a user definable circuit area 24. The circuit occupying the user definable circuit area 24 is interface-connected through a parallel module test multiplexer(PMT MUXs) 26 to the digital signal processor 12. Also, the circuit formed on the chip 10 is bonded through a uiversal input/output(I/O) bonding pad 28 to the other component of an integrated data processing system. Thus, the problems in terms of the signal transmission mutually between the chips are eliminated.