MARKING OR ERASING ON SEMICONDUCTOR CHIP PACKAGE

摘要

An apparatus and method for marking or erasing a marking on a semiconductor chip package (16). The apparatus includes a circular disk (102) with circumferentially arranged pockets (34) for holding semiconductor chip (16). Each pocket (34) has a pedestal (36) rising from the bottom for supporting the bottom portion of a package (16). The edges of the pocket (34) and the pedestal (36) define between them space suitable for housing the package leads (18). The pedestal (36) has a hole (42) therein which can be evacuated so that the package (16) is held to the pedestal (36) by atmospheric pressure with sufficient force to allow markings to be made or erased from the top surface (16a) of the package (16). The package leads (18) therefore are not bent or otherwise disturbed. Rotation of the disk (102) allows sequential treatment of the packages (16).