发明名称 |
IMPROVED SIDE GATE TYPE MOLD ARRANGEMENT WITH POINTED HEAT-GENERATING MODULE |
摘要 |
A side gate type mold arrangement for use in runnerless injection molding is incorporated with a pointed intermittently heat-generating module (1) having a non-axial heating tip (4) such that the non-axial tip type module is mounted in an axial recess or through-hole of the mold arrangement with the non-axial tip (4) being substantially received in the side or non-axial gate (36B). The mold arrangement comprises a cavity half block (36) defining a cavity half (36A) with the side gate (36B) open thereto and another block element. The axial recess or through-hole is defined by the cavity half block and the other block element in combination, and is changeable in a cross-sectional size in a direction perpendicular to the mold axis due to a relative perpendicular movement therebetween. |
申请公布号 |
WO9113742(A1) |
申请公布日期 |
1991.09.19 |
申请号 |
WO1990JP00347 |
申请日期 |
1990.03.15 |
申请人 |
SEIKI CORPORATION CO., LTD. |
发明人 |
TSUTSUMI, SHIGERU |
分类号 |
B29C45/26;B29C45/27 |
主分类号 |
B29C45/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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