发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE
摘要 PURPOSE:To contrive to reduce the manhour of a component mounting work by a method wherein an electronic component mounting work region is partitioned into 3 areas along a substrate transfer direction, mounting work heads are respectively arranged at the areas only at both ends of the 3 areas and the central area is used as a standby area. CONSTITUTION:A working region is partitioned into 3 pieces of areas W1 to W3 along a substrate transfer direction and the individual areas W1 and W3 at both ends excluding the central area W2 among 3 pieces of the areas W1 to W3 are provided with each substrate supporting means U for supporting a transferred substrate in such a way as to freely move vertically between a transfer path Sb and a mounting work position Pp. In this case, while a mounting of an electronic component is executed at one side of two places of the work stations W1 and W3, a continuous mounting preparation operation for stopping, pushing up and positioning the printed board Pb is executed at the other work station. Thereby, a wasteful time for making mounting work heads stand by until a mounting preparation operation is completed can be dissolved and it becomes possible to reduce an electronic component mounting time.
申请公布号 JPH03214798(A) 申请公布日期 1991.09.19
申请号 JP19900009805 申请日期 1990.01.19
申请人 YAMAGATA KASHIO KK;CASIO COMPUT CO LTD 发明人 TAKAHASHI TAKAYUKI
分类号 B23P19/04;H05K13/04 主分类号 B23P19/04
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