Electroless copper plating process.

摘要

An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, (14) and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, (12) and an electroless metal depositing apparatus for carrying out the process. <IMAGE>