| 摘要 |
PURPOSE:To make a via, which is not different from conventional vias, in a multilayer ceramic circuit board by a method wherein a through hole is made in a via hole formation position of a ceramic green sheet, a conductor paste formed by adding a ceramic powder to a metal powder is filled into the hole and the via hole is formed. CONSTITUTION:Dimethyl phthalate as a plasticizer is added, by using polymethyl methacrylate as a binder, to a ceramic powder and a glass powder which are respectively in prescribed weight ratios. Acetone in a prescribed ratio is added to the mixture. They are kneaded. After that, acetone is evaporated. A green sheet is made. A through hole in a prescribed diameter is made in the green sheet by using a drill while a Mylar sheet is attached. On the other hand, a Cu powder with which an Al2O3 powder in a prescribed average particle size has been mixed is used as a conductor paste. The through hole is filled. The binder is removed while this assembly is being heated in a moistened atmosphere of N2. In addition, this assembly is baked in an atmosphere of N2. A good via hole without a bore is formed. |
