| 发明名称 |
Solder interconnection structure on organic substrates and process for making. |
| 摘要 |
<p>Solder interconnection whereby the gap created by solder connections between an organic substrate (2) and semiconductor device (1) is filled with a composition (7) obtained from curing a thermosetting preparation containing a thermosetting binder; and filler having a maximum particle size of 50 microns. <IMAGE></p> |
| 申请公布号 |
EP0446666(A2) |
申请公布日期 |
1991.09.18 |
| 申请号 |
EP19910102393 |
申请日期 |
1991.02.20 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HSIAO, RICHARD;MCCREARY, JACK MARLYN;MARKOVICH, VOYA RISTA;SERAPHIM, DONALD PHILLIP |
| 分类号 |
H01L21/56;H01L21/60;H01L23/14;H01L23/29 |
主分类号 |
H01L21/56 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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