Method and apparatus for grinding diamond and diamond product using the same.

摘要

The invention refers to a method of grinding the surface (1a) of a diamond (1), a respective apparatus and a diamond product. The side surface (4a) of a laser beam (4) is brought into contact with the diamond (1), and the side surface (4a) of the laser beam (4) is relatively moved along the surface (1a) of the diamond (1) while giving thermal energy of the laser beam (4) to the surface (1a) of the diamond (1). The diamond (1) thus ground can be used in a cutting tool and a heat sink.