首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD FOR FORMING MULTILEVEL INTERCONNECTION IN A SEMICONDUCTOR DEVICE
摘要
申请公布号
GB9116831(D0)
申请公布日期
1991.09.18
申请号
GB19910016831
申请日期
1991.08.05
申请人
SAMSUNG ELECTRONICS CO LTD
发明人
分类号
H01L21/768
主分类号
H01L21/768
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Back-hair-trim-guide with an adjustable mirror for man
SYSTEM AND METHOD FOR ALIGNING CHROMA PIXELS
HYDROMULCH CONTAINER MEDIUM
Run-Time Characterization of On-Demand Analytical Model Accuracy
MAIN DUCT WITH INNER DUCT AND METHOD FOR PRODUCING THE SAME
Live Catch Rodent Trap
Portable device for swatting and collecting bugs
BRICK, STONE AND TILE TRANSPORT AND DEPLOYMENT SYSTEM
APPARATUS AND METHOD FOR COPLANARITY TESTING
COMBINATION CONTAMINANT SIZE AND NATURE SENSING SYSTEM AND METHOD FOR DIAGNOSING CONTAMINATION ISSUES IN FLUIDS
Sliding cover faceplate and electronic device using the same
SECURITY FEATURE RFID CARD
Replaceable probe
Clock Aware Placement
Message Signaled Interrupt Management for a Computer Input/Output Fabric Incorporating Platform Independent Interrupt Manager
Crane trim, list, skew and snag protection system
Broadcasting device having power frequency carrier
Portable handheld work apparatus
COATING MATERIAL BASED ON A COPPER-INDIUM-GALLIUM ALLOY, IN PARTICULAR FOR THE PRODUCTION OF SPUTTER TARGETS, TUBULAR CATHODES AND THE LIKE
Apparatus and method for transmitting signals over a signal line
