| 摘要 |
PURPOSE:To enhance connection reliability by a method wherein a conductor of a thin metal film provided with required malleability is formed on a via conductor of a laminated board. CONSTITUTION:A conductor pattern 2 provided with malleability which is sufficient to absorb expansion and contraction caused by a thermal process of a conductor 13 which is composed of a first layer 2a of thin titanium film, a second layer 2b of thin aluminum film and a third layer 2c of thin chromium film is connected to a via conductor 3 of a ceramic laminated board 1. Consequently, even when the conductor 3 is expanded and contracted repeatedly against a ceramic, it is possible to prevent a crack from being produced in the pattern 2 and to prevent the pattern from being floated from the conductor 3; connection reliability can be increased. |
