发明名称 |
Solder assembly of components |
摘要 |
Disclosed is an apparatus, method, and resulting product involving soldering of components, such as the soldering of flexible circuits to printed circuit boards. Holes are provided in the areas of one component which are to be soldered to pads on the other component. Precise amounts of solder are provided to each pad, preferably by means of a shuttle element which carries solder paste in cavities corresponding to the pads and which deposits the solder on the pads when the solder is melted. The holes in the component are aligned with the pads, and the solder is reflowed so that a visible solder fillet is formed above the holes to permit inspection of the solder joint.
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申请公布号 |
US5048747(A) |
申请公布日期 |
1991.09.17 |
申请号 |
US19900560901 |
申请日期 |
1990.07.31 |
申请人 |
AT&T BELL LABORATORIES |
发明人 |
CLARK, WILLIAM A.;OIEN, MICHAEL A.;PELOSI, WALTER |
分类号 |
H05K1/02;H05K3/28;H05K3/34;H05K3/36 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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