| 摘要 |
<p>PURPOSE:To equalize the potential of each wafer so as to enable the same wafer carrier to be used even during cleaning treatment by equipping a wafer carrier with a wafer conduction member capable of mounting and removal, and bringing it into contact with each wafer in a wafer carrier, and then making each wafer conductive electrically with each other. CONSTITUTION:When a wafer conduction part is attached to a wafer carrier after wafers are stored in the wafer carrier, the wafers 5 stored in the wafer carrier and the comb-shaped projection 7 of a wafer conduction part contact with each other, and the exchange of charge occurs between wafers through the wafer conduction part, and the potential of each wafer becomes equal. Moreover, when processing the wafers in chemicals, the corrosion of the wafer conduction part can be prevented by removing the wafer conduction part and performing chemical treatment. Since the wafers in the carrier becomes the same potential, the dust adhesion by Coulomb force can be prevented without causing electric fields among wafers, and also since a mounting jig is attached to the wafer conduction part, an existing wafer carrier can be made use of only by boring an attaching hole in the carrier main body, and the wafer conduction part can be mounted or removed easily.</p> |
