发明名称 Method of bonding a semiconductor device with a substrate
摘要 An improved tape automated bonding is disclosed. A heater head employs a heat conducting member and a bonding tip member. The heat conducting member formed of a material, such as molybdenum or tungsten, has a U-shaped contour which comprises a pair of halves and an interconnection for generating bonding heat by undergoing high frequency electric current. The bonding tip member is bonded to the interconnection of the conducting member. The tip member is formed of material, such as diamond or cubic boron nitride, which is higher in resistivity and thermal conductivity than the conducting member.
申请公布号 US5048180(A) 申请公布日期 1991.09.17
申请号 US19900490049 申请日期 1990.03.07
申请人 CASIO COMPUTER CO., LTD. 发明人 TANAKA, TAKAYOSHI
分类号 B23K3/02;B23K3/04;B23K3/047;H01L21/00;H01L21/60;H01L21/603;H01R4/02;H05K3/34 主分类号 B23K3/02
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