| 摘要 |
PURPOSE:To make it possible to adopt many kinds of metal fine wires and manufacture a semiconductor device of low manufacturing cost and high reliability by bonding a metal fine wire to a bonding pad and an external conductor, heating and setting thermally a conductive paste. CONSTITUTION:One end of a metal fine wire 13 is bonded to a bonding pad 10a by an adhesive and thermosetting conductive paste 12. The other end of the metal fine wire is bonded to an external conductor 11a by the conductive paste 12, and the bonding pad 10a is connected electrically with the external conductor 11a. Therefor, there is no necessity to adopt an expensive gold wire as the metal fine wire 13, and the metal fine wire 13 is bonded surely to the bonding pad 10a and the external conductor 11a. Thereby, the adoption of many kinds of metal fine wires is made to be possible, and the manufacturing of the semiconductor device of low cost and high reliability becomes possible. |
