发明名称 Bi CMOS/SOI process flow
摘要 The invention provides a bipolar transistor structure on a buried oxide layer for use in an integrated circuit and a method for fabricating the same. The invention may be incorporated into a method for fabricating bipolar transistors in a BiCMOS structure. The bipolar transistor is constructed in two stacked epitaxial layers. The first epitaxial layer is used to form both the MOSFET and the buried collector of the bipolar transistor. The second epitaxial layer is grown as a blanket epitaxial layer. The intrinsic collector and the base of the bipolar transistor are formed in the second epitaxial layer. An oxide layer is formed over the base. The emitter is formed of a polysilicon layer which is deposited through an opening in the oxide layer such that the polysilicon layer contacts the second epitaxial layer.
申请公布号 US5049513(A) 申请公布日期 1991.09.17
申请号 US19900583418 申请日期 1990.09.17
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 EKLUND, ROBERT H.
分类号 H01L27/06;H01L21/331;H01L21/762;H01L21/764;H01L21/8249;H01L27/12 主分类号 H01L27/06
代理机构 代理人
主权项
地址