Electronic circuit device and method of manufacturing same

摘要

Plural semiconductor elements are buried into an insulating substrate, and top surfaces of semiconductor elements and the substrate are in a same plane. A photosensitive dry film is covered on surfaces of the substrate and semiconductor elements. The photosensitive dry film has openings corresponding to electrodes of semiconductor elements, and conductors are filled in openings of the photosensitive dry film. The device has the multi-layer wiring construction without damaging to semiconductor elements arranged on the substrate.