| 摘要 |
Means for coupling an electrooptical device, such as a semiconductor laser, to an optical fiber avoids heat-induced stresses that commonly result from joining methods employing welding, soldering, or catalytic adhesive compositions. In this invention, the electrooptical device and fiber are firmly mounted within separate elements, such as copper tubes, by means of potting compound or the like, and after close end-to-end supported alignment of the device and fiber elements to obtain optimum light coupling, the assemblage is immersed in an electrolytic plating solution. Plating current is then applied and maintained until a sufficiently strong layer of plating metal encompasses the tubular elements and thereby rigidly fixes the alignment of the device and fiber end at its optimum position. Since the plating operation proceeds in a substantially isothermic environment, there is no misaligning stress introduced which would otherwise degrade the coupling efficiency.
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