| 摘要 |
PURPOSE:To improve the accuracy of out-of-roundness and to allow high-speed processing by positioning the center of a round hole to be bored in a plate material to the axial center of a rotary processing head, then executing drilling and the movement of the axial center in accordance with the on and off of the pulse command from an NC device. CONSTITUTION:The center of the round hole to be bored in the plate material W is positioned to the center of the optical axis of the rotary processing head 1 in the case of processing of a round hole in the plate material W by a laser beam LB. The rotary processing head 1 is thereafter rotated and the hole processing is executed by the laser beam LB from a laser oscillator 27 when the pulse command from the NC device 33 is on. The rotary processing head 1 is moved relative to the plate material W when the pulse command from the NC device is off. The center of the optical axis of the rotary processing head 1 is thereby moved to the center of the round hole to be bored in the plate material W. Many pieces of the same holes are bored by repeating the above-mentioned operation. |
