发明名称 THERMALLY DISPERSABLE SOLDER- ING FLUX
摘要 PURPOSE: To provide a soldering flux which does not leave visible residues on a printed circuit board by constituting the soldering flux of specific weight % of camphor as a flux base, an org. activator and the balance substantially at least one org. diluent. CONSTITUTION: The thermally dissipated cleaningless soldering flux is composed of about 10 to about 20 wt.% camphor as the flux base, about 1 to about 5 wt.% org. activator and the balance substantially at least one org. diluent. The org. activator is formed of aliphat. dicarboxylic acid having about 2 to 6 carbon atoms. The org. diluent is formed of aliphat. alcohol having about 1 to 4 carbon atoms. As a result, the cleaningless flux is provided.
申请公布号 JPH03210994(A) 申请公布日期 1991.09.13
申请号 JP19900302817 申请日期 1990.11.09
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 EBERITSUTO UIRIAMU MEISU;JIYANETSUTO SHITSUKURAA;BARADARAJIYAN SURINIBASAN
分类号 B23K35/363;B23K35/36;B23K101/40 主分类号 B23K35/363
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