发明名称 POSITIVE TYPE PHOTORESIST COMPOSITION
摘要 PURPOSE:To form patterns having excellent heat resistance and image contrast and to obviate the generation of scum after development by compounding a specific compd. with a compsn. consisting of an alkaline-soluble novolak resin having a specific dissolving rate and a quinonediazide group-contg. compd. CONSTITUTION:This compsn. is formed by incorporating the alkaline-soluble novolak resin having the dissolving rate in an aq. soln. of 8% tetramethyl ammonium hydroxide at 23 deg.C within a 50 to 1,000Angstrom /sec, the quinonediazide group- contg. compd. and alpha,alpha',alpha''-tris(4-hydroxyphenyl)-1, 3, 5-triisopropyl benzene into the compsn. The resist patterns having the excellent heat resistance and image contrast are formed in this way. The positive type photoresist compsn. which does not generate the scum in thus obtd.
申请公布号 JPH03210563(A) 申请公布日期 1991.09.13
申请号 JP19900006820 申请日期 1990.01.16
申请人 TOKYO OHKA KOGYO CO LTD 发明人 TOKUTAKE NOBUO;OBARA HIDEKATSU;NAKAYAMA TOSHIMASA
分类号 G03F7/022;G03F7/023;H01L21/027 主分类号 G03F7/022
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