| 摘要 |
PURPOSE:To prevent generation of defects like cracks in resin injected in a frame body molding a semiconductor device, by forming a depression having a plurality of stages on a supporting lead of a semiconductor element mounting part for mounting a semiconductor element. CONSTITUTION:A depression having a plurality of stages is formed on a supporting lead 2 of a semiconductor element mounting part 1. The depression having a plurality of stages can be formed, e.g. by press-working, one time or a plurality of times, the above-mentioned supporting lead 2 of the semiconductor element mounting part. As to the supporting lead 2, of the semiconductor element mounting part, on which the depression having a plurality of stags is formed, its physical strength is remarkably increased. Thereby the defect that the lead 2 is floated by the pressure at the time of injecting resin in a frame body or the pressure at the time of resin curing and the defect that the lead 2 is fixed in an inclined state can be prevented. |
