LEAD FRAME FOR RESIN SEALED TYPE SEMICONDUCTOR DEVICE,申请号JP19900005104-传众专利搜索

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发明名称	LEAD FRAME FOR RESIN SEALED TYPE SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH03209860(A)	申请公布日期	1991.09.12
申请号	JP19900005104	申请日期	1990.01.12
申请人	NEC CORP	发明人	NISHIKAWA HIDEYUKI
分类号	H01L23/50	主分类号	H01L23/50
代理机构		代理人
主权项
地址

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