| 摘要 |
PURPOSE:To enhance the connecting reliability between a large semiconductor device and a die pad by forming one or a plurality of holes in a semiconductor- device mounting die pad, and removing air and bubbles of solvent and the like generated in an bonding agent in curing which are causes of the remaining of voids and unhardened part. CONSTITUTION:A bonding agent 3 is generally hardened from the outer surface part. Therefore, the larger a semiconductor device 4, the harder the removal of the air and solvent components remaining in the inside. When a hole 7 penetrating a board 1 and a die pad 2 is formed, air stagnating in the bonding agent and bubbles generated from the solvent can be discharged and removed. As the bonding agent, the conductive agent wherein silver powder is mixed as a filler is used. At this time, the die pad itself is made to be the ground so as to made the rear side of the semiconductor to be the electric ground. Therefore, when the inner wall of the hole 7 is metallized and the rear surface of the substrate is made to be the ground, it is effective to achieve the grounding directly by way of the through hole.
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