发明名称 SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To rapidly transfer data without degrading discharge characteristics of a bus driving circuit, by arranging a power supply wiring of exclusive use for the bus driving circuit, in a wiring region. CONSTITUTION:Data bus 16 is constituted of eight signal lines D0-D7 composed of metal, e.g. aluminum, and formed in a wiring region 30 on a chip. A power supply wiring 41 constituted of aluminum is formed in the wiring region 30, so as to be adjacent to the data bus 16, and used for a reference voltage (GND). A diffusion layer 34 is connected with one signal line constituting the data bus 16, e.g. the signal line D5, via a contact hole 38. A diffusion layer 36 is connected with the power supply wiring 41 of GND, via a contact hole 38.
申请公布号 JPH03209757(A) 申请公布日期 1991.09.12
申请号 JP19880333615 申请日期 1988.12.28
申请人 TOSHIBA CORP;TOSHIBA MICRO ELECTRON KK 发明人 NAKADA SHIGEJI;ANDO KAZUMASA
分类号 H01L21/3205;H01L21/82;H01L21/822;H01L23/52;H01L23/528;H01L27/04;H01L27/118 主分类号 H01L21/3205
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