摘要 |
<p>PURPOSE:To prevent dust from attaching on a wafer by forming an air curtain of clean air on the outer periphery of ring type vacuum sucking grooves, and forming low a ring type surface equipped with a jetting outlet of clean air, via a step from the flat surface of a sucking part. CONSTITUTION:The upper central part of a vacuum sucking part 12 forms a flat surface 12a, which is constituted so as to accept the rear of a wafer 50. The upper outer periphery of the vacuum socking part 12 is a ring type surface 12b formed low via a step from said flat surface 12a. Further a clean air jetting outlet 36 of a concentric circle type in reference to vacuum sucking grooves 24 of a concentric circle type is arranged on the ring type surface 12b formed low via the step from the central flat surface 12a.</p> |