| 摘要 |
An integrated circuit package having a low reflection input pin comprising a high frequency signal conductor (16) internal to the semiconductor package provided by coupling a first input pin (31) to a second input pin (32) with a conductor path (16), the conductive path having a constant characteristic impedance which matches the characteristic impedance of an external signal line (14) which is coupled to the first input pin. A portion of the conductive path (16) forms a bonding pad used for wire bonding, or other bonding technique, between the conductive path and a bonding pad (46) of the integrated circuit. In this manner the impedance mismatch between an external signal conductor and the integrated circuit bonding pad is eliminated, and the total impedance mismatch between the semiconductor package and the external signal line is greatly reduced, resulting in higher frequency operation of the integrated circuit. |
