RESIN MOLD PACKAGED ELECTRONIC PARTS

摘要

A packaged electronic part, comprising a substrate (1), and lead frame (2) having a plurality of leads (24) and a support plate (21), each lead (24) having an inner lead part (24b) and an outer lead part (24a), and a resin mold package (6) packaging the substrate (1), lead frame (2) and inner lead parts (24b), wherein the substrate (1) is provided with a plurality of devoid portions (3a, 3b) whereby the overall edge length of an outline of the substrate (1) is increased and adhesion between the substrate (1) and the resin mold is improved.