Device for mounting electronic power casings in housing.

摘要

Mounting and cooling device for electronic power casings such as semi-conductor modules in a housing which houses an electronic arrangement. Several traversing passages are made in the base (14) of a heat sink (11) and tapped studs (20) are integral with the bottom (16) of the casing (13). Threaded bolts (18) for tightening down the casings onto the heat sink are screwed into the tapped holes (20a) of the studs in order to fix simultaneously the heat sink to the bottom of the casing. <IMAGE>