| 摘要 |
<p>PURPOSE: To attain a high separating speed with small pressing force by including a rocking arm arranged on a tool side in a parallelogrammatic linkage in a device for separating a wafer from a silicon block. CONSTITUTION: This device is provided with a tool holder 1, a blade-like tool 2, a workpiece support base 3 and a drive device 4 activating the tool holder 1. The drive device 4 gives a rocking motion with the prescribed rocking radius Rs to the tool holder 1. Parallelogrammatic levers 5 are shown to clarify this motion mode. The tool 2 has a nonlinear cutting edge 6. The cutting edge 6 is formed into an arc shape having an arc radius Rb, and an arc-like cutting contour 7 having a cutting contour radius Rw is formed. The arc radius Rb of the cutting edge 6 is larger or smaller than the cutting contour radius Rw in all cases. The rocking radius Rs is selected to invariably make the work contact in the form of quasi-contact 8 between the cutting edge 6 and the cutting contour 7.</p> |
