发明名称 PRINTED WIRING BOARD FOR IC CARD
摘要 <p>PURPOSE:To securely execute the bonding without applying a bonding wire to a bonding hole by forming the bonding wire into a planar tapered shape and arranging the leading end thereof toward the connection terminal of the electronic part mounted on an electronic part loading part. CONSTITUTION:A bonding hole 30 is formed into a planar tapered shape and the leading end thereof is arranged toward the connection terminal of the electronic part 20 mounted on an electronic part loading part 11 to set the area of the copper foil not supported by a base material and an area of a region to which gold plating is required to the necessary min. degree. By forming the bonding hole 14 into the planar tapered shape and arranging the leading end thereof toward the connection terminal of the electronic part 20 mounted on the electronic part loading part 11, only a part having the possibility of the application of a bonding wire 30 is efficiently notched.</p>
申请公布号 JPH03207697(A) 申请公布日期 1991.09.10
申请号 JP19900002248 申请日期 1990.01.08
申请人 IBIDEN CO LTD 发明人 MORI MIKIO;SATAKE HIROAKI;YANAGAWA YOJI;FURUKAWA KAZUHIRO
分类号 B42D15/10;G06K19/077;H01L23/12 主分类号 B42D15/10
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