| 摘要 |
PURPOSE:To always obtain an excellent accuracy by applying an ultrasonic ray, etc., finely converged by supplying ozone to a resist part on a reference mark, and locally removing the resist by evaporating. CONSTITUTION:A reference mark 2 on a semiconductor substrate 1 is covered with a resist 3, an ultraviolet ray or a charged beam finely converted by supplying ozone 6 is applied, the resist is locally completely burned and removed by evaporating. Accordingly, the resist is not dispersed as residue or the like therearound, but can be effectively favoritely removed, and then accurately aligned. |
