发明名称 CURING APPARATUS OF RESIN ADHESIVE FOR DIE-BONDING USE
摘要 PURPOSE:To eliminate a wire-bonding defect caused by the adhesion of a gas by a method wherein an interval is formed between a heat source for lead-frame heating use and a lead frame and nitrogen is blown from the upper part of the lead frame. CONSTITUTION:A lead frame 3 on which a die 1 is attached by a silver paste 2 is held so as to be slid freely on conveyance rails 4a and 4b; it is conveyed via a feed claw. When, e.g., a heater block is heated to 400 deg.C, a nitrogen-heating block 11 is heated to 350 deg.C and nitrogen is supplied at 5 to 10l/min, it is confirmed that the best condition is obtained when an interval between a heater block 8 and the lead frame 3 is 2 to 3 mm. When the lead frame is fed intermittently by using claw 6 in this state, the silver paste is heated and hardened, and the die is fixed and bonded to the lead frame 3. Since a gas from the silver paste flows to the lower part by nitrogen supplied from the upper part and by the flow of a duct sucking from the lower part, it does not adhere to a lead and an electrode pad and a good curing operation can be executed.
申请公布号 JPH03206628(A) 申请公布日期 1991.09.10
申请号 JP19900001902 申请日期 1990.01.08
申请人 NEC CORP 发明人 SHIOZAKI AKIO
分类号 H01L21/52 主分类号 H01L21/52
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